CV

Education, research experience, publications, projects, and technical skills.

Contact Information

Name Yiming Du
Professional Title Ph.D. Student at Fudan University
Email iiamadoga@163.com

Professional Summary

Researcher in AI for EDA with interests in LLM-assisted chip design automation, digital back-end physical design, macro placement, timing closure, analog design intelligence, and automated circuit design flows.

Experience

  • 2024 - 2026

    Beijing, China

    Joint Master's Student, School of Integrated Circuits
    Peking University
    Artificial Intelligence for Electronic Design Automation.
    • Researched LLM-driven digital physical design optimization, especially macro placement.
    • Worked on intelligent automation methods for analog circuit design.
  • 2024 - 2024

    Beijing, China

    Research Intern, AI for Science Institute
    Beijing Lunlun Research Institute (PKU Science Park)
    Multimodal knowledge acquisition and semantic generation for scientific research.
    • Built systems for multimodal document understanding, knowledge extraction, domain-specific LLM fine-tuning, and intelligent research assistants.
    • Integrated LangChain task-chain design with Claude 3.5 multi-turn interaction for PDF/image parsing, summary generation, and dynamic Markdown/HTML presentation.
  • 2023 - 2024

    Hefei, China

    Master's Student, School of Integrated Circuits
    Anhui University
    Integrated Circuit Design Engineering.
    • Worked on AI-assisted EDA methodologies and circuit optimization techniques.

Education

  • 2026 - Present

    Shanghai, China

    Ph.D. Student
    Fudan University
    Fudan Institute of Systems for Advanced Computing (FiSAC)
  • 2024 - 2026

    Beijing, China

    Joint Master's Student
    Peking University
    School of Integrated Circuits
    • Research focused on AI for Electronic Design Automation (EDA), including LLM-assisted macro placement optimization and intelligent automation for analog circuit design.
    • Advised by Asst. Researcher Ling Liang and co-advised by Prof. Yimao Cai.
  • 2023 - 2026

    Hefei, China

    M.Eng.
    Anhui University
    Integrated Circuit Engineering
    • Received the M.Eng. degree in Integrated Circuit Engineering in 2026.
  • 2018 - 2022

    Wuhu, China

    B.Eng.
    Anhui Polytechnic University
    Electrical Engineering

Publications

Skills

Programming (Advanced): C/C++, Python, Verilog HDL, Tcl, Perl, SKILL, Shell
EDA Tools (Advanced): Cadence Virtuoso, Innovus, Genus, OpenROAD
Scientific Computing (Advanced): PyTorch, TensorFlow, NumPy, Pandas, Matplotlib, MATLAB

Interests

Research Areas: AI for EDA, LLM-assisted chip design automation, macro placement, physical design, timing closure, analog design intelligence, and automated design flows

Projects

  • LLM-Assisted Digital Backend Macro Placement Optimization

    Multi-agent macro placement framework for digital physical design optimization.

    • Designed Analysis, Group, Floorplan, and Verification agents.
    • Built ModuLink Weight Analyzer and Standard Cell Usability Score modules.
    • Evaluated the flow on Nangate45, Sky130, and RISC-V benchmarks.
  • Analog Front-End Flow Optimization

    AI-EDA framework for automated analog amplifier design.

    • Integrated LLMs and GNNs for specification understanding, topology planning, netlist generation, and closed-loop parameter optimization.
    • Proposed a metric-conditioned graph neural network for gain, GBW, phase margin, and power prediction.
  • Multimodal Research Knowledge System

    Multimodal knowledge collection and semantic generation system for scientific research scenarios.

    • Supported key-structure extraction from PDF text and images, image saliency analysis, paper structure parsing, and summary generation.
    • Produced dynamic Markdown/HTML research presentations.